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the journal of industry and technology a link between industry and technology akrometrix wins a 2017 npi award for its next generation axp shadow moiré system at apex akrometrix, llc, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, have been awarded a 2017 npi award in the category of first article inspection for the new axp 2.0. the award was presented to the company during a tuesday, feb. 14, 2017 ceremony that took place at the san diego convention center during the ipc apex expo. akrometrix wins a 2017 npi award for its next generation axp shadow moiré system at apex “we are thrilled that our next-generation shadow moiré system – the axp 2.0 – has won this award,” stated mayson brooks, akrometrix president. “we took the feedback from all of our customers on what they needed in warpage metrology, and our engineers and manufacturing team designed/built the system in record time, under budget.” axp 2.0 is the industry leader in not only providing thermal warpage, but has optional modules for both dic strain/cte measurements and dfp for discontinuous surfaces. utilizing a novel combination of both top and bottom heaters with shadow moiré, akrometrix is providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform. premiering in 2008, the npi awards program is an annual celebration of product excellence in electronics surface mount assembly. premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts. akrometrix llc in profile akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the pcb/component markets. the company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°c to 300°c on virtually any substrate up to 600mm x 600mm, regardless of shape. located in atlanta, georgia, akrometrix has been serving customers worldwide for more than 20 years based on technology developed at georgia tech. for further information, e-mail: [email protected] or view website: www.akrometrix.com refer tp page 756 juki automation systems and storage solutions receive the 2017 npi award for component storage juki automation systems (jas), inc., a world-leading provider of automated assembly products and systems and part of juki automation systems corporation, together with storage solutions, a division of essegi system service s.r.l., were awarded a joint 2017 npi award. the award was presented to the companies in the component storage category for the new ism ultraflex 3600 during the ipc apex expo. the ultraflex 3600 is able to dynamically adjust the internal subdivision of space to accommodate changing mixes of reel heights from 8 up to 88mm, and diameters from 7 to 15″. the new case designs allow storage of jedec trays on any case format (both 7 and 15″ wide). the ism ultraflex 3600 offers the utmost in flexiblity, storage capacity, intelligence and roi in the industry. it can communicate across a wide variety of vendor platforms. capable of providing up to 54 reels for production simultaneously, the ism3600 can read low parts, warning to output the required reel in advance. with the capability to grow reels up to 88mm in height, the ism3600 is the next piece in building out your smart factory. juki automation systems and storage solutions receive the 2017 npi award for component storage the new machine and case designs enable the ultraflex 3600 to store a maximum number of 3600 7″-8mm reels, but can accept any mix of reel sizes. during idle time, the machine will automatically sort cases to optimize the distribution of reels of different formats, always providing the maximum possible storage capacity. the system can communicate with all major brands of smt placement systems and software updates are available at no additional cost. the optional dehumidification kit can keep the internal relative humidity below the five percent level during all standard operations. premiering in 2008, the npi awards program is an annual celebration of product excellence in electronics surface mount assembly. premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts. the axi500c is capable of counting the latest 03015s as well as (4) 7″ or (1) 15″ reels of various thicknesses. in addition to counting reels, the axi5100c also can count components in esd bags, storage sticks, and trays. the axi5100c is a fully automated inline system that can handle loading and unloading of components using various conveyors, loaders/unloaders and even robots. the key advantage of the inline counter is the ability to communicate directly with the juki ism component storage towers offering complete and confident automation of component inventory. the se600™ 3d spi system delivers ‘true’ volume measurement and world-class usability. designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits. the award-winning software offers full touch screen capability and world-class user experience for easy, flawless inspection. the mid-speed rs-1 features one multi-function head new head – the lnc120 with a 12mm pitch and eight nozzles as well as a diffuser for vision. the lnc-120 head laser moves up and down depending on component height, resulting in the highest cph regardless of component height. combined with the “new” rf electronic feeders, the system has an optimal throughput of 40,000cph. with new odd-form recognition technology, the rs-1 provides easy data entry for odd-form parts. the rv-2 pwb visual inspection machine (aoi/spi) offers many benefits, including space-saving and compact single-lane inspection. the high-speed head unit features 3d projectors in four directions and a 2d high-speed color camera (160fps 160 images/sec). the juki proprietary designs provides reduced image capturing time and reduced image processing time along with 34 faster inspection time compared to other systems (0.41sec/fov). the modular selective solder system is designed to be more easily retrofit-able to existing configurations than competition with limited downtime at install with very minor additional training or program modification to be back running production within 2-3 days. additionally, it is designed to exceed the competition in maintainability from ease of access and with future improvements/upgrades to exceed the competition in all areas. in addition to the new product introductions, juki demonstrated the ism ultraflex 3600 storage tower, jm-20 hybrid through-hole system, gl plus fully automatic screen printer, rs-600 air reflow oven, and ke3020 and rx-6 placement machines. the cube.460 the cube.460 selective solder system sets the new standard for dual nozzle mini-wave soldering systems. the unique cube.460 batch platform offers excellent flexibility for through-hole applications. the cube.460 can be configured with a single nozzle or dual nozzle for increased flexibility. the system comes equipped with many standard features that include heated nitrogen at the soldering nozzle, 0° and 7° soldering to accommodate various types of nozzles and an exchangeable pot system to support both leaded/unleaded alloys. the rx-6r/rx-6b the rx-6r/rx-6b high-speed compact modular mounter built on the same platform as the proven, reliable rx-6. this compact system has a width of just 1.25m and the new head design results in increased placement speed over the previous model. replaceable heads allow user to configure a production line best suited to the current requirements. the gl fully automatic screen printer the gl fully automatic screen printer enables users to achieve 01005 (0402 metric) printing utilizing a patented mathematical calculating algorithm to ensure the machine’s high accuracy print alignment. additionally, the system features a patented pcb flexible auto clamp (fac) system and stencil position memory (spm) function for easy and quick change-over. essemtec wins the 2017 npi award for multifunction placement for the new fox² essemtec were awarded a 2017 npi award in the category of component placement – multifunction for its fox2. the award was presented to the company during a tuesday, feb. 14, 2017 ceremony that took place during the ipc apex expo. this marks the 15th industry award that the swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. essemtec wins the 2017 npi award2 the new fox2 by essemtec combines jetting of solder paste or glue and placement in a single machine. the new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments. fox2 has a machine footprint of just 1m2 and can accept pcb sizes up to 16 x 12″. components with sizes from 01005 up to 1.3 x 3.1″are placed. the machine achieves 7,500 cph (ipc9805a) at 50 µm, 3 sigma with a two nozzle head. premiering in 2008, the npi awards program is an annual celebration of product excellence in electronics surface mount assembly. premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts. the swiss equipment manufacturer essemtec is the global innovation leader for flexible production systems for electronic assembly and packaging. essemtec has been developing, manufacturing and marketing equipment for all processes in the electronics industry since 1991: such as printers, jet dispensers, pick-and-place and soldering systems. manual, semiautomatic and fully automatic systems are available. the range of products also includes transportation and storage systems, as well as software solutions for planning, simulation optimization and documentation of manufacturing. all essemtec systems are optimized for maximum flexibility. users can switch from one product to another quickly, making maximum use of available production capacity. for further information about essemtec’s smt production center, view website: www.essemtec.com refer to page 351 kyzen is two for two with the 2017 npi awards for the analyst™ and ds3522 duosolvent™ kyzen received two 2017 npi awards. the company was awarded in the category of process control tools for the new analyst™ real-time concentration monitoring & reporting system, and cleaning materials for the kyzen® ds3522 duosolvent™ cleaning agent. the awards were presented to the company during a tuesday, feb. 14, 2017 ceremony that took place at the san diego convention center during the ipc apex expo. the kyzen analyst is the first of its kind, state-of-the-art wash bath concentration monitoring and reporting system that maximizes performance of virtually all chemistries, not just a few. the kyzen analyst uses direct measurement technology, a high-precision measurement technique that includes fast and stable analytical methods that are independent of conductivity, color and transparency of the process liquids. these results are available online and are updated every second. kyzen is two for two with the 2017 npi awards kyzen ds3522 is a broad spectrum cleaning agent designed for kyzen’s duosolvent process which cleans a wide variety of parts and soils in a process that does not employ any water. it is the only waterless cleaning process that is effective on virtually all lead-free materials. ds3522 is effective for the removal of virtually all types of fluxes including rosin, low residue/no-clean and organic acid flux. premiering in 2008, the npi awards program is an annual celebration of product excellence in electronics surface mount assembly. premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts. kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. kyzen’s industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. founded in 1990, kyzen is the leading provider of environmentally responsible, rohs compliant cleaning chemistries to industries worldwide. for further information, view website: www.kyzen.com refer to page 872. life sciences and clinical instrumentation the life sciences sector businesses supply a range of consumables, instrumentation and related services to the healthcare and environmental industries. healthcare (84% of revenues) – clinical diagnostic instrumentation, consumables and services supplied to hospital pathology and life sciences laboratories for the testing of blood, tissue and other samples. surgical medical devices and related consumables and services supplied to hospital operating rooms, gi/endoscopy suites and clinics. environmental (16% of revenues) – environmental analysers, containment enclosures and emissions monitoring systems. the drylin zlw linear robot system is explained in more detail, in a video, by motion plastics specialist, igus. this modular drive system enables engineers to design and configure their own ready-to-install linear robots with maximum flexibility. with the drylin zlw system, machine builders can address various design challenges and working environments in a diverse range of applications, rapidly and at lower cost than custom build solutions. molex has introduced the industry’s first odva conformance tested and approved ip67 ethernet/ip i/o module to interface with roller drives. the space-saving brad® harshio modules are machine-mountable to connect industrial controllers to roller drives directly, even in the toughest environments. interfacing with up to 4 roller drives makes the modules an economical choice for conveyor applications. image: 60mm digital i/o modules deliver ip67-rated on-machine reliable solution for interfacing industrial controllers with motorised rollers in harsh duty environments. surface mount technology production equipment smt (surface mount technology) component placement systems, commonly called pick-and-place machines or p&ps, are robotic machines which are used to place surface-mount devices (smds) onto a printed circuit board (pcb). they are used for high speed, high precision placing of broad range of electronic components, like capacitors, resistors, integrated circuits onto the pcbs which are in turn used in computers, consumer electronics as well as industrial, medical, automotive, military and telecommunications equipment. during this time, a typical smt assembly line employed two different types of pick-and-place (p&p) machines arranged in sequence. the unpopulated board was fed into a rapid placement machine. these machines, sometimes called chip shooters, place mainly low-precision, simple package components such as resistors and capacitors. these high-speed p&p machines were built around a single turret design capable of mounting up to two dozen stations. as the turret spins, the stations passing the back of the machine pick up parts from tape feeders mounted on a moving carriage. as the station proceeds around the turret, it passes an optical station that calculates the angle at which the part was picked up, allowing the machine to compensate for drift. then, as the station reaches the front of the turret, the board is moved into the proper position, the nozzle is spun to put the part in proper angular orientation, and the part is placed on the board. typical chip shooters can, under optimal conditions, place up to 53,000 parts per hour, or almost 15 parts per second.[citation needed] because the pcb is moved rather than the turret, only lightweight parts that will not be shaken loose by the violent motion of the pcb can be placed this way. from the high speed machine, the board transits to a precision placement machine. these pick-and-place machines often use high resolution verification cameras and fine adjustment systems via high precision linear encoders on each axis to place parts more accurately than the high-speed machines. furthermore, the precision placement machines are capable of handling larger or more irregularly shaped parts such as large package integrated circuits or packaged inductor coils and trimpots. unlike the rapid placers, precision placers generally do not use turret mounted nozzles and instead rely on a gantry-supported moving head. these precision placers rely upon placement heads with relatively few pickup nozzles. the head sometimes has a laser identifier that scans a reflective marker on the pc board to orient the head to the board. parts are picked up from tape feeders or trays, scanned by a camera (on some machines), and then placed in the proper position on the board. some machines also center the parts on the head with two arms that close to center the part; the head then rotates 90 degrees and the arms close again to center the part once more. the margin of error for some components is, in many cases, less than half a millimeter (less than 0.02 inches). the process is a little slower than rapid placement, necessitating careful line balancing when setting up a job, lest the precision placement machine become a production bottleneck.[citation needed] blum debuted surface measurement system at mach 2016 mach is the outstanding showcase for advances in the manufacturing industry brought to you by the manufacturing technologies association (mta), a uk based trade association dealing specifically with engineering based manufacturing. it is a biennial exhibition which brings together all the best innovations and latest developments to come from the manufacturing technologies sectors under one roof. blum novotest included a uk exhibition debut to its exciting new line of surface roughness gauges. launched at emo in the autumn, the new tc63-rg and tc64-rg digilog surface finish gauges were the centre piece of the blum novotest stand. blum debuted surface measurement system at mach 2016 appearing alongside the company’s renowned range of component measuring and testing technology, the new tc63-rg and tc64-rg digilog surface roughness gauges mark a quantum leap in regard to roughness measurement for machine integrated quality control methods. in essence, the new tc63-rg and tc64-rg gauges can evaluate the surface roughness of the part whilst it remains clamped in the machine tool. this enables early detection of poor surface quality. for the end user, the benefits are immediate. reject parts are reduced by enabling immediate re-working whilst the part is still clamped in the machining or turning centre. this improves productivity, process reliability and it eliminates downstream testing processes. all this is provided by a system that incorporates a wear-free opto-electronic measuring element and blum novotest’s renowned shark 360 technology that is the benchmark in precision probing systems. the two systems have been developed to optimise the process for the end user. for example, the tc64-rg operates like a standard probing system whereby the measuring stylus is moved along uniform surfaces. this is ideal for monitoring the surfaces of parts machined on a 3-axis machine tool. in comparison, the tc63-rg system is completely modular and can be adapted and applied to 5-axis machine tools that are producing parts with complex features that may be difficult to reach with a standard probing system. the precision of the tc63-rg when measuring non-uniform surfaces is guaranteed by the shark 360 technology that incorporates a two-faced gear that eliminates twisting forces and eradicates sideways deflection for extremely precise readings. using brc radio technology as its signal transmission, the new ip68 probes can be incorporated into any machine tool with a bt, hsk, sk, bth and vdi spindle configurations. since their autumn launch, the new tc63-rg and tc64-rg digilog surface finish gauges have proven extremely effective within the automotive industry on components like valve seats that have a critical surface dimension. for manufacturers of high volume parts, the probes are being implemented to scan the master component and use the readings from the master as the median for all consequent parts in a batch run. life sciences and clinical instrumentation lavision biotec reports on the ground-breaking research on the adult nervous system by dr nicolas renier from the rockefeller university in new york. lavison biotec, developers of advanced microscopy solutions for the life sciences, report on the work of nicolas renier, a post-doctoral fellow in the laboratory of marc … drs nicolas renier and zhuhao wu are post-doctoral fellows in the laboratory of marc tessier-lavigne at the rockefeller university in new york where they have co-developed methodologies to develop new imaging techniques applying light sheet microscopy to the study axon rewiring in adult nervous systems. it is hoped that this could lead to an understanding as to how experience or even pathologies such as alzheimer’s disease modify the way the brain is wired. two great advantages have been behind their motivation to use the lavision biotec ultramicroscope: high speed and large fields of view. for neuroanatomy, most of the time, users want to look at large regions, up to 1 cm wide. also, there is the need to image a lot of samples to get statistical significance, so a very high acquisition speed is required. to date, they feel this is the only microscope on the market that can do that so far. 2-photon microscopy is sometimes used for volume imaging when the need is to go to higher magnifications, and confocal or epifluorescence microscopies are used for classical histology done on sections. talking about his use of the ultramicroscope, dr renier says “this is the only microscope that has a built-in compatibility with the 3disco clearing method, which in our hands is still the best clearing method. the main strength of the technique is the ease of implementation and flexibility in sample handling. the speed also compares favorably to other methods. lastly, the signal to noise ratio of alexa dyes combined with 3disco clearing and light sheet microscopy is extremely high.” asked how he sees the technique and methodology develop, dr renier says “we are now using idisco1 routinely in the lab for most of our projects. the technique has upgraded most of our histology assays and we now rarely section tissues anymore. we use the technique to study the trajectory of nerves in whole embryos, to count cell number in whole organs, to trace single axons in the brain. the technique can be used for large screens, thus enabling quick phenotyping of mutants, something that is usually challenging in mice. we are working on trying to take the technique beyond classical immunostaining. volume mrna in situ hybridization is an avenue to be explored. we are also looking at testing additional labeling techniques, including the use of llama b nanobodies and chemical tag based labeling.” new vacuum storage solution for fib, sem and tem samples now available from em resolutions em resolutions, manufacturers and suppliers of tools and accessories for users of electron microscopes, launches the em-storr vacuum sample storage container. em resolutions offer the em-storr vacuum sample storage container which has been specifically developed to protect em samples under vacuum during storage and transportation. em-storr has a modern space saving design and superior construction using high vacuum compatible materials to reduce outgassing and to hold vacuum for extended periods. available in versions for tem grids, fib half grids, sem stubs of various types and other valuable em samples, protecting them from air, moisture and dust. an added advantage is em-storr can be stacked on top of each other saving valuable space in the em laboratory. for further information on em-storr and other storage accessories for em please contact em resolutions. view website: www.emresolutions.com/em-storr-vacuum-sample-storage-container em resolutions in profile em resolutions was founded in 2012 to supply high quality tem support films to laboratory consumables companies in the uk. they have grown to become a limited company manufacturing and distributing support films, calibration standards and other em consumables directly to end users as well as worldwide through a growing network of distributors. we combine many years’ experience in the microscopy industry with listening to customer needs and supplying the best quality products with a prompt and professional service. understanding pcb design & material warpage challenges – learn more at smtai akrometrix, llc, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that ryan curry, technical account manager, will co-present a paper with don adams, manufacturing engineering manager at bose corporation, during smta international. the presentation, “understanding pcb design and material warpage challenges which occur during b2b/module-carrier attachment,” is scheduled to take place during session apt7, “package and pcb interactions,” on wednesday, september 28th at 4 p.m. pcb warpage has been identified as one of several key contributors to unacceptable yield rates during reflow assembly of a pcb module to a pcb carrier board. the module has a land grid array pattern and is placed directly on solder paste on the carrier board. this results in low-profile solder joints that are sensitive to the co-planarity of both the module and the carrier boards. the typical failure mode occurs when one or more solder joint opens are caused by a lifted corner of the module during/after reflow. understanding pcb design & material warpage challenges – learn more at smtai this paper and presentation will present graphical and statistical details of at-room-temperature metrology on a large sample of modules with differing design variables. shadow moiré technique will be used to provide accurate warpage profiles of the 6-up module arrays before and after top- and bottom-side assembly, and again before and after attachment to the carrier board. a large volume of samples will be tested in order to gain statistical relevance of the data and correlate any yield problems to initial warpage. the objective is to isolate the key design parameter(s) that contribute most to attachment problems while also observing and reporting on the at-temperature warpage behavior of the substrates during reflow. curry is the technical account manager at akrometrix, having shifted to this role after almost 11 years of experience as a test and applications engineer. he is a subject matter expert in at temperature warpage and strain measurement techniques. curry has experience with frequent use of akrometrix measurement tools for contract testing services and demonstration work, along with domestic and international customer support, technical sales, outgoing system quality assurance, software and npi development work, and akrometrix system installation and user training. he has a degree in mechanical engineering from the georgia institute of technolo for further information, e-mail: [email protected] or view website: www.akrometrix.com automated die attach tilt metrology akrometrix llc has developed an automated die-board (or daughter-mother board) attach tilt metrology. all akrometrix shadow moiré or dfp systems (axps) can be upgraded with the new feature. as die, components or daughter boards become thinner, their geometric relationship to their mounting board – before and after solder reflow – is important to ensure full connectivity exists and to prevent pre-mature failures. once these components have undergone the reflow process, it is imperative that a flat and full connection is achieved to ensure these two separate and often different types of materials are properly mated. akrometrix’s axp warpage measurement systems, using both shadow moiré and digital fringe projection (dfp) have a new feature that allows users to measure the tilt angle of the bottom substrate to a mounted die/component/daughter board. often called “die-tilt” or “die attach tilt”, akrometrix has embedded this feature into its existing software platform (studio) to allow customers to automatically measure both warpage metrology and die attach tilt metrology on a wide variety of substrates, eliminating the human or manual/subjective measurement commonly done today. these measurements can be conducted pre-reflow at various temperature profiles during reflow and during reflow cooldown to examine the effects that die placement and temperature have on the mating angle. complete measurement of warpage and die attach tilt takes less than two seconds per measurement point along the temperature profile to complete. “akrometrix’s shadow moiré systems have become the industry standard for warpage measurement, especially at temperature,” noted mayson brooks, akrometrix’s president and ceo. “with the addition of our die attach tilt metrology, we have further expanded our capabilities to provide a truly expandable platform for a wide range of measurement needs. being able to measure both warpage and die attach tilt on the same equipment increases the capabilities of our axp as customers want to have equipment sets that are multi-functional and a higher return on investment.” akrometrix llc in profile akrometrix llc, the leader in elevated temperature surface characterization, was founded in 1993 by dr. charles ume, a professor and director of the advanced electronic packaging and laser processing laboratory, at the george w. woodruff school of mechanical engineering, georgia institute of technology, atlanta, georgia. headquartered in atlanta, akrometrix supports over 250 equipment installations worldwide. for further information, e-mail: [email protected] or view website: www.akrometrix.com 1 2 next page » recent posts akrometrix wins a 2017 npi award for its next generation axp shadow moiré system at apex juki automation systems and storage solutions receive the 2017 npi award for component storage essemtec wins the 2017 npi award for multifunction placement for the new fox² kyzen is two for two with the 2017 npi awards for the analyst™ and ds3522 duosolvent™ life sciences and clinical instrumentation about us the journal of industry and technology is an international scholarly refereed research journal which aims to promote the theory and practice of technology, innovation, and engineering management. the journal links engineering, science, and management disciplines. it addresses the.

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  SERVER biz.whois-servers.net

  ARGS thejournalofindustryandtechnology.biz

  PORT 43

  TYPE domain

DOMAIN

  NAME thejournalofindustryandtechnology.biz

  HANDLE D11074294-BIZ

  CREATED 2000-09-28

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clientTransferProhibited https://icann.org/epp#clientTransferProhibited
autoRenewPeriod https://icann.org/epp#autoRenewPeriod

NSERVER

  DNS14.PARKPAGE.FOUNDATIONAPI.COM 199.79.61.224

  DNS13.PARKPAGE.FOUNDATIONAPI.COM 209.99.40.224

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  HANDLE C11074293-BIZ

  NAME William Hammerton

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The Journal of Industry and Technology
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  CITY Ely

  PCODE CB6 2UL

  COUNTRY GB

  PHONE +44.1353699094

  EMAIL [email protected]

ADMIN

  HANDLE C11074293-BIZ

  NAME William Hammerton

  ORGANIZATION thejournalofindustryandtechnology.biz

ADDRESS

STREET
The Journal of Industry and Technology
8 Matthew Wren Close

  CITY Ely

  PCODE CB6 2UL

  COUNTRY GB

  PHONE +44.1353699094

  EMAIL [email protected]

TECH

  HANDLE C11074293-BIZ

  NAME William Hammerton

  ORGANIZATION thejournalofindustryandtechnology.biz

ADDRESS

STREET
The Journal of Industry and Technology
8 Matthew Wren Close

  CITY Ely

  PCODE CB6 2UL

  COUNTRY GB

  PHONE +44.1353699094

  EMAIL [email protected]

  REGISTERED yes

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